Display device

ABSTRACT

A display device according to an embodiment of the present disclosure includes a main FPCB including a plurality of LEDs in a block unit on one surface and a connector connected to the LEDs on the other surface, a sub-FPCB connected to the connector of the main FPCB, and a cover bottom in which the main FPCB is disposed and the sub-FPCB is connected to the outside through an open area. In each block, the plurality of LEDs is disposed in series by a plurality of first connection electrodes and second connection electrodes. Also, wherein the first and second via holes are disposed within the blocks, and one end of the first connection electrode and one end of the second connection electrode are exposed by a first via hole and a second via hole. Therefore, it is possible to reduce a routing area and a bezel area.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of Korean Patent Application No.10-2021-0136728 filed on Oct. 14, 2021, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND Technical Field

The present disclosure relates to a display device, and moreparticularly, to a light emitting diode (LED) display device with areduced bezel size.

Description of the Related Art

Liquid crystal display (LCD) devices and organic light emitting display(OLED) devices, which have been widely used so far, find more and moreapplications.

The LCD device and the OLED device have advantages such as a highresolution screen, a small thickness, and a light weight. Therefore,they are widely applied to screens of everyday electronic devices suchas mobile phones or notebooks and the applicable range of these devicesis gradually expanded.

However, in the LCD device and OLED device, there can be a limitation inreducing the size of a bezel area which does not display an image in thedisplay device but is visible to a user. For example, as for the LCDdevice, a sealant needs to be used to seal liquid crystals and bondupper and lower substrates. Thus, there is a limitation in reducing thesize of the bezel area. Further, as for the OLED device, an organiclight emitting diode is made of an organic material and thus vulnerableto moisture or oxygen. Thus, it is necessary to provide an encapsulationunit for protecting the organic light emitting diode and there is alimitation in reducing the size of the bezel area. In particular, it isimpossible to implement a super-size screen with a single panel. Thus,when a super-size screen is implemented by tiling a plurality of liquidcrystal display panels or a plurality of organic light emitting displaypanels, a bezel area between adjacent panels can be seen by a user.

As an alternative to this, a light emitting diode (LED) display deviceincluding LEDs has been proposed. Since the LED is made of an inorganicmaterial rather than an organic material, it has excellent reliabilityand has a longer lifespan compared to the LCD device or the OLED device.Further, the LED is suitable for a super-size screen because it exhibitshigh lighting speed, low power consumption, and high impact resistance,which results in excellent stability, and can display a high-brightnessimage.

BRIEF SUMMARY

LED display devices may comprise a micro LED display device or a miniLED display device depending on the size of an LED.

In an LED display device, LEDs are designed for each block, which is aminimum unit of a serial configuration of LEDs, to reduce a bezel area,and a film on film (FOF) bonding pad area is reduced. However, in orderto reduce the FOF bonding pad area, the order of pads may be changed andthe number of layers may be increased according to a via hole avoidancedesign.

Accordingly, the present inventors have invented an LED display devicein which a novel block structure reduces an FOF bonding pad area withouta via hole avoidance design and an increase in the number of layers,and, thus, a bezel area can be minimized or reduced.

Also, the present inventors have invented an LED display device in whicha sensor unit is provided between LEDs to reduce the space where thesensor unit has been located and which can implement additionalfunctions such as skin care or sterilization.

The technical benefits of the present disclosure are not limited to theabove-mentioned benefits, and other benefits, which are not mentionedabove, can be clearly understood by those skilled in the art from thefollowing descriptions.

According to one embodiment of the present disclosure, the displaydevice includes a main flexible printed circuit board (FPCB) including aplurality of light emitting diodes (LEDs) in a block on one surface anda connector connected to the plurality of LEDs on the other surface.Also, the display device includes a sub-FPCB connected to the connectorof the main FPCB, and a cover bottom in which the main FPCB is disposedand the sub-FPCB is connected to the outside through an open area. Ineach block, LEDs of the plurality of LEDs are disposed in series by aplurality of first connection electrodes and second connectionelectrodes. Also, first and second via holes are disposed within theblocks, and one end of the first connection electrode may be exposed byone of the first via holes and one end of the second connectionelectrode may be exposed by one of the second via holes.

Other detailed matters of the embodiments are included in the detaileddescription and the drawings.

In a display device according to the present disclosure, a connectorbetween an anode and a cathode and via holes are aligned in a horizontaldirection within a block. Also, blocks on and under an open area areconnected on the same layer by a connection line or connected ondifferent layers by a connection line through the first and second viaholes. Thus, a routing area and a bezel area can be reduced. Therefore,it is possible to reduce costs of a sub-flexible printed circuit board(FPCB) and reduce process errors.

Further, in the display device according to the present disclosure, asensor unit such as an illumination sensor, a proximity sensor, and afingerprint sensor is provided between LEDs. Therefore, it is possibleto reduce the space where the sensor unit has been located and implementa skin care function using near infrared light or a sterilizationfunction using ultraviolet (UV) light.

The effects of the display device according to embodiments of thepresent disclosure are not limited to the aforementioned effects, andvarious other effects are included in the present disclosure.

The effects according to the present disclosure are not limited to thecontents exemplified above, and more various effects are included in thepresent specification.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The above and other aspects, features, and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view schematically illustrating an LED assemblyaccording to a first embodiment of the present disclosure;

FIG. 2 is a cross-sectional view showing a partial structure of the LEDassembly according to the first embodiment of the present disclosure;

FIG. 3 is a cross-sectional view showing a structure of an LEDillustrated in FIG. 2 ;

FIG. 4 is a perspective view schematically illustrating a tiling LEDdisplay device in which a plurality of LED assemblies is tiled;

FIG. 5 is a cross-sectional view schematically illustrating an LEDdisplay device according to the first embodiment of the presentdisclosure;

FIG. 6 shows an example of a layout of lines in the LED assemblyaccording to the first embodiment of the present disclosure;

FIG. 7 is an enlarged view of a portion A of FIG. 6 ;

FIG. 8 schematically illustrates a block structure illustrated in FIG. 7;

FIG. 9 illustrates an example of a block structure according to acomparative embodiment;

FIG. 10 shows an example of a layout of lines in an LED assemblyaccording to the comparative embodiment;

FIG. 11 is a cross-sectional view schematically illustrating an LEDdisplay device according to a second embodiment of the presentdisclosure;

FIG. 12 shows an example of a layout of lines in an LED assemblyaccording to a third embodiment of the present disclosure; and

FIG. 13 is a cross-sectional view schematically illustrating an LEDdisplay device according to a fourth embodiment of the presentdisclosure.

DETAILED DESCRIPTION

Advantages and characteristics of the present disclosure and a method ofachieving the advantages and characteristics will be clear by referringto embodiments described below in detail together with the accompanyingdrawings. However, the present disclosure is not limited to theembodiments disclosed herein but will be implemented in various forms.The embodiments are provided by way of example only so that thoseskilled in the art can fully understand the disclosures of the presentdisclosure and the scope of the present disclosure.

The shapes, sizes, ratios, angles, numbers, and the like illustrated inthe accompanying drawings for describing the embodiments of the presentdisclosure are merely examples, and the present disclosure is notlimited thereto. Like reference numerals generally denote like elementsthroughout the specification. Further, in the following description ofthe present disclosure, a detailed explanation of known relatedtechnologies may be omitted to avoid unnecessarily obscuring the subjectmatter of the present disclosure. The terms such as “including,”“having,” and “consist of” used herein are generally intended to allowother components to be added unless the terms are used with the term“only.” Any references to singular may include plural unless expresslystated otherwise.

Components are interpreted to include an ordinary error range even ifnot expressly stated. When the position relation between two parts isdescribed using the terms such as “on,” “above,” “below,” and “next,”one or more parts may be positioned between the two parts unless theterms are used with the term “immediately” or “directly.”

When an element or layer is disposed “on” another element or layer,another layer or another element may be interposed directly on the otherelement or therebetween.

Although the terms “first,” “second,” and the like are used fordescribing various components, these components are not confined bythese terms. These terms are merely used for distinguishing onecomponent from the other components. Therefore, a first component to bementioned below may be a second component in a technical concept of thepresent disclosure.

Like reference numerals generally denote like elements throughout thespecification.

A size and a thickness of each component illustrated in the drawing areillustrated for convenience of description, and the present disclosureis not limited to the size and the thickness of the componentillustrated.

The features of various embodiments of the present disclosure can bepartially or entirely adhered to or combined with each other and can beinterlocked and operated in technically various ways, and theembodiments can be carried out independently of or in association witheach other.

Hereinafter, embodiments of the present disclosure will be described indetail with reference to accompanying drawings.

FIG. 1 is a perspective view schematically illustrating an LED assemblyaccording to a first embodiment of the present disclosure.

Referring to FIG. 1 , an LED assembly 100 according to the firstembodiment of the present disclosure may be composed of a main flexibleprinted circuit board (FPCB) 110 and a plurality of LEDs 140 disposed onthe main FPCB 110.

A plurality of pixel areas P may be positioned in the main FPCB 110.

The pixel area P may form a block, which is a minimum unit of a serialconfiguration of the LEDs 140.

Although not illustrated in the drawings, the main FPCB 110 may be a TFTarray substrate, and a thin film transistor and various lines fordriving the LED 140 may be formed in the pixel area P. When the thinfilm transistor is turned on, a driving signal input from the outsidethrough a line is applied to the LED 140 and the LED 140 emits light.The LED 140 may be used as a backlight or may be used to implement animage.

In each pixel area P of the main FPCB 110, nine LEDs 140R, 140G, and140B each emitting light of a single color such as R, G, and B arerepeatedly disposed. Thus, R, G, and B LEDs 140R, 140G, and 140B mayemit light of R, G, and B colors in response to a signal applied fromthe outside. However, the present disclosure is not limited to thenumber of LEDs 140R, 140G, and 140B disposed in each pixel area P, e.g.,each block.

The LEDs 140R, 140G, and 140B may be manufactured by a process separatefrom a TFT array process of the main FPCB 110. In a typical organiclight emitting display device, both a TFT array substrate and an organicemission layer are formed by a photolithography process. However, in theLED display device according to the present disclosure, the thin filmtransistor and various lines disposed on the main FPCB 110 are formed bya photolithography process, but the LEDs 140R, 140G, and 140B may bemanufactured by a separate process. In this case, the LEDs 140R, 140G,and 140B may be disposed on a substrate 111 by a transfer process, butare not limited thereto.

The LEDs 140 may have a size of several μm to several hundreds of μm.The LEDs 140 may be formed by thin film growing a plurality of inorganicmaterials such as Al, Ga, N, P, As, In, etc., on a sapphire substrate ora silicon substrate and then cutting and separating the sapphiresubstrate or the silicon substrate.

As such, the LEDs 140 are formed in a micro-size, and, thus, they may betransferred to a flexible substrate such as a plastic substrate.Therefore, a flexible display device can be manufactured. Further,unlike the organic emission layer, the LED 140 is formed by thin filmgrowing an inorganic material, and, thus, the manufacturing process canbe simple and the yield can be improved. Furthermore, the LEDs 140 aresimply transferred onto a large area substrate, and, thus, a large areadisplay device can be manufactured. Also, the LEDs 140 made of aninorganic material have advantages such as a high brightness and a longlifespan compared to LEDs manufactured with an organic light emittingmaterial.

Although not illustrated in the drawings, a plurality of gate lines anddata lines may be disposed in a vertical or horizontal direction on themain FPCB 110 so as to define the plurality of pixel areas P in a matrixform. In this case, the gate line and the data line are connected to theLED 140, and a gate pad and a data pad each connected to the outside areprovided at end portions of the gate line and the data line,respectively. Thus, a signal from the outside may be applied to the LED140 through the gate line and the data line so that the LED 140 operatesto emit light.

FIG. 2 is a cross-sectional view showing a partial structure of the LEDassembly according to the first embodiment of the present disclosure.

For the convenience of description, FIG. 2 illustrates an example of astructure of a sub-pixel disposed at an outer portion of the LED displaydevice. However, the present disclosure is not limited thereto.

Referring to FIG. 2 , a thin film transistor TFT may be disposed in adisplay area of the substrate 111 and a pad 152 may be disposed in a padarea.

The substrate 111 is made of a transparent material such as glass, butit is not limited thereto and may be made of other transparentmaterials. Also, the substrate 111 may be made of a flexible transparentmaterial.

The thin film transistor TFT may be composed of a gate electrode 101, asemiconductor layer 103, a source electrode 105, and a drain electrode107.

Referring to FIG. 2 , the gate electrode 101 may be formed on thesubstrate 111. Also, a gate insulating layer 112 may be formed on theentire area of the substrate 111 and may cover the gate electrode 101.Further, the semiconductor layer 103 may be formed on the gateinsulating layer 112, and the source electrode 105 and the drainelectrode 107 may be formed on the semiconductor layer 103.

The gate electrode 101 may be made of a metal, such as Cr, Mo, Ta, Cu,Ti, Al, or an alloy thereof. The gate insulating layer 112 may be formedas a single layer of an inorganic material such as SiOx or SiNx or amultilayer of SiOx and SiNx.

The semiconductor layer 103 may be made of an amorphous semiconductor,such as amorphous silicon, or an oxide semiconductor, such as indiumgallium zinc oxide (IGZO), TiO₂, ZnO, WO₃, or SnO₂. If the semiconductorlayer 103 is made of an oxide semiconductor, the size of the thin filmtransistor TFT can be reduced, a driving power can be reduced and anelectric mobility can be improved. However, in the present disclosure,the semiconductor layer of the thin film transistor is not limited to aspecific material.

The source electrode 105 and the drain electrode 107 may be made of ametal, such as Cr, Mo, Ta, Cu, Ti, Al, or an alloy thereof. In thiscase, the drain electrode 107 may serve as a first electrode to apply asignal to the LED 140.

Meanwhile, although the thin film transistor TFT is illustrated as abottom gate type thin film transistor in the drawings, the presentdisclosure is not limited thereto. A thin film transistor having variousstructures such as a top gate type thin film transistor may be applied.

The pad 152 disposed in the pad area may be made of a metal, such as Cr,Mo, Ta, Cu, Ti, Al, or an alloy thereof. The pad 152 may be formed by adifferent process from the gate electrode 101 of the thin filmtransistor TFT. However, in order to simplify the process, the pad 152may also be formed by the same process as the gate electrode 101.

Although not illustrated in the drawings, the pad 152 may be formed onthe gate insulating layer 112. In this case, the pad 152 may be formedby a different process from the source electrode 105 and the drainelectrode 107 of the thin film transistor TFT. However, in order tosimplify the process, the pad 152 may be formed by the same process asthe source electrode 105 and the drain electrode 107.

Also, a second electrode 109 may be formed on the gate insulating layer112 in the display area. In this case, the second electrode 109 may bemade of a metal, such as Cr, Mo, Ta, Cu, Ti, Al, or an alloy thereof.Further, the second electrode 109 may be formed by the same process asthe source electrode 105 and the drain electrode 107 of the thin filmtransistor TFT.

Further, a first insulating layer 114 may be formed on the substrate 111on which the thin film transistor TFT has been formed, and the LED 140may be disposed on the first insulating layer 114 in the display area.Although it is illustrated in the drawings that a part of the firstinsulating layer 114 is removed and the LED 140 is disposed in theremoved area, the first insulating layer 114 may not be removed. Thefirst insulating layer 114 may be formed as an organic layer, such asphoto-acryl, or may have a multilayered structure including an inorganiclayer and an organic layer or an inorganic layer, an organic layer, andan inorganic layer.

The LED 140 is mainly made of Group III-V nitride semiconductormaterials, but is not limited thereto.

FIG. 3 is a cross-sectional view showing a structure of an LEDillustrated in FIG. 2 .

Referring to FIG. 3 , the LED 140 according to the first embodiment ofthe present disclosure may include, for example, an undoped GaN layer144 and an n-type GaN layer 145 disposed on the GaN layer 144. Also, theLED 140 may include, for example, an active layer 146 having amulti-quantum well (MQW) structure and disposed on the n-type GaN layer145, and a p-type GaN layer 147 disposed on the active layer 146.Further, the LED 140 may include, for example, an ohmic contact layer148 made of a transparent conductive material and disposed on the p-typeGaN layer 147, and a p-type electrode 141 in contact with a part of theohmic contact layer 148. Furthermore, the LED 140 may include, forexample, an n-type electrode 143 in contact with a part of the n-typeGaN layer 145 that is exposed by etching a part of the active layer 146,the p-type GaN layer 147, and the ohmic contact layer 148.

The n-type GaN layer 145 is a layer for supplying electrons into theactive layer 146, and may be formed by doping a GaN semiconductor layerwith n-type impurities, such as Si.

The active layer 146 is a layer in which the injected electrons andholes are combined to emit light.

The MQW structure of the active layer 146 includes a plurality ofbarrier layers and well layers alternately disposed. The well layers areformed as InGaN layers and the barrier layers are formed as GaN layers,but are not limited thereto.

The p-type GaN layer 147 is a layer for injecting holes into the activelayer 146, and may be formed by doping a GaN semiconductor layer withp-type impurities, such as Mg, Zn, and Be.

The ohmic contact layer 148 is a layer for an ohmic contact between thep-type GaN layer 147 and the p-type electrode 141. The ohmic contactlayer 148 may be made of a transparent metal oxide, such as indium tinoxide (ITO), indium gallium zinc oxide (IGZO), or indium zinc oxide(IZO).

The p-type electrode 141 and the n-type electrode 143 may be formed as asingle layer or a multilayer of at least one metal of Ni, Au, Pt, Ti,Al, and Cr or an alloy thereof.

In the LED 140 configured as described above, when a voltage is appliedto the p-type electrode 141 and the n-type electrode 143, electrons andholes are injected from the n-type GaN layer 145 and the p-type GaNlayer 147, respectively, to the active layer 146. Then, excitons aregenerated within the active layer 146. As the excitons decay, lightcorresponding to the energy difference between the lowest unoccupiedmolecular orbital (LUMO) and the highest occupied molecular orbital(HOMO) of the emission layer is generated and emitted to the outside.

The wavelength of the light luminescent from the LED 140 can be adjustedby adjusting the thickness of the barrier layers in the MQW structure ofthe active layer 146.

Although not illustrated in the drawings, the LED 140 may bemanufactured by forming a buffer layer on a substrate and growing a GaNthin film on the buffer layer. In this case, sapphire, silicon (Si),GaN, silicon carbide (SiC), gallium arsenide (GaAs), zinc oxide (ZnO),etc., may be used as a substrate for growing the GaN thin film.

The n-type GaN layer 145 may be formed by growing a GaN layer 144 notdoped with impurities and then doping n-type impurities, such as Si, onan upper part of the undoped thin film. Also, the p-type GaN layer 147may be formed by growing an undoped GaN thin film and then doping p-typeimpurities, such as Mg, Zn, and Be.

Although it is illustrated in FIG. 2 that the LED 140 having a specificstructure is disposed on the first insulating layer 114, the presentdisclosure is not limited to the LED 140 having such a specificstructure. LEDs in various structures, such as a vertically structuredLED and a horizontally structured LED, may be applied.

Referring back to FIG. 2 , a second insulating layer 116 may be formedon the first insulating layer 114 on which the LED 140 has beendisposed.

The second insulating layer 116 may be formed as an organic layer, suchas photo-acryl, or may have a multilayered structure including aninorganic layer and an organic layer or an inorganic layer, an organiclayer, and an inorganic layer. The second insulating layer 116 covers anupper part of the LED 140.

A first contact hole 114 a and a second contact hole 114 b are formed inthe first insulating layer 114 and the second insulating layer 116 onthe thin film transistor TFT and the second electrode 109, respectively.Thus, the drain electrode 107 and the second electrode 109 of the thinfilm transistor TFT can be exposed to the outside. In addition, a thirdcontact hole 116 a and a fourth contact hole 116 b are formed in thesecond insulating layer 116 on the p-type electrode 141 and the n-typeelectrode 143, respectively, of the LED 140. Thus, the p-type electrode141 and the n-type electrode 143 can be exposed to the outside.

Although FIG. 2 illustrates the two insulating layers 114 and 116, thisis to suppress an excessive increase in processing time occurring when asingle insulating layer is formed. Therefore, it is not necessary toform a plurality of insulating layers 114 and 116, and a singleinsulating layer may be formed. Also, the number of insulating layers114 and 116 may be two or more.

A first connection electrode 117 a and a second connection electrode 117b made of a transparent metal oxide, such as ITO, IGZO, or IGO, areformed on the second insulation layer 116. Thus, the drain electrode 107of the thin film transistor TFT and the p-type electrode 141 of the LED140 may be electrically connected by the first connection electrode 117a through the first contact hole 114 a and the third contact hole 116 a.Also, the second electrode 109 and the n-type electrode 143 of the LED140 may be electrically connected by the second connection electrode 117b through the second contact hole 114 b and the fourth contact hole 116b.

In addition, a buffer layer 118 made of an inorganic material and/or anorganic material may be formed on an upper surface of the substrate 110so as to cover the LED 140 and the pad 152.

FIG. 4 is a perspective view schematically illustrating a tiling LEDdisplay device in which a plurality of LED assemblies is tiled.

A tiling LED display device 200 shown in FIG. 4 is a display device inwhich a plurality of LED assemblies 100 configured as shown in FIG. 1 istiled. For the convenience of description, FIG. 4 illustrates that fourLED assemblies 100 are tiled. However, six, eight or more LED assemblies100 may be tiled to form the tiling LED display device 200.

Referring to FIG. 4 , the tiling LED display device 200 according to thefirst embodiment of the present disclosure may be formed by placing orconnecting a plurality of LED assemblies 100 in a matrix form.

Each LED assembly 100 may include a plurality of pixel areas P (orblocks), and a plurality of LEDs 140 may be disposed in each pixel areaP.

The LED 140 may include at least R, G, and B LEDs 140R, 140G, and 140Bemitting light of three colors, respectively. The LED 140 may emit whitelight.

Although not illustrated in the drawings, a gate line, a data line, anda thin film transistor to implement the LED 140 may be formed in eachpixel area P of the LED assembly 100.

Meanwhile, the LED display device does not need to be provided with asealant and an encapsulation unit or structure unlike an LCD device oran OLED device, and, thus, the size of a bezel area can be reduced.Further, in the LED display device, LEDs are designed for each block,which is a minimum unit of a serial configuration of LEDs, to reduce abezel area, and a film on film (FOF) bonding pad area is reduced.However, in order to reduce the FOF bonding pad area, the order of padsmay be changed and the number of layers may be increased according to avia hole avoidance design.

Accordingly, the present inventors have invented an LED display devicein which a novel block structure reduces an FOF bonding pad area withouta via hole avoidance design and an increase in the number of layers,and, thus, a bezel area can be minimized or reduced.

FIG. 5 is a cross-sectional view schematically illustrating an LEDdisplay device according to the first embodiment of the presentdisclosure.

FIG. 6 shows an example of a layout of lines in the LED assemblyaccording to the first embodiment of the present disclosure.

FIG. 7 is an enlarged view of a portion A of FIG. 6 .

FIG. 8 schematically illustrates a block structure illustrated in FIG. 7.

For the convenience of description, FIG. 8 illustrates an area where theLEDs 140 are mounted.

Referring to FIG. 5 through FIG. 8 , the LED display device according tothe first embodiment of the present disclosure may include the main FPCB110 where the plurality of LEDs 140 is mounted. Also, the LED displaydevice may include a sub-FPCB 130 connected to the main FPCB 110 and acover bottom 120 in which the plurality of LEDs 140 and the main FPCB110 are accommodated.

For example, the LED 140, the main FPCB 110, and the sub-FPCB 130 mayform a backlight unit or backlight. In this case, a liquid crystal panel(not shown) may be disposed above the backlight unit and the coverbottom 120 configured to cover the backlight unit may be disposed underthe backlight unit. However, the present disclosure is not limitedthereto. The LED 140 itself may implement an image. In this case, aliquid crystal panel may not be required.

The main FPCB 110 may be attached to an inner upper surface of the coverbottom 120 by a predetermined or selected adhesive layer 125. In thiscase, a connector for example, anisotropic conductive film (ACF) 135connected to the sub-FPCB 130 is provided on a rear surface of the mainFPCB 110. Also, the sub-FPCB 130 may be connected to the ACF 135 on therear surface of the main FPCB 110 and then connected to the outsidethrough an open area 136 formed in the cover bottom 120.

One end of the sub-FPCB 130 may be bent to the rear surface of the mainFPCB 110 and located within the open area 136, and may be connected tothe main FPCB 110 through the ACF 135.

Meanwhile, according to the first embodiment of the present disclosure,the plurality of LEDs 140 is not disposed in the open area 136. That is,the LED 140 is disposed to avoid an FOF bonding pad area W within theopen area 136. Thus, it is possible to suppress damage to the LED 140caused by being pressed when bonding the main FPCB 110 and the sub-FPCB130 to each other.

Also, according to the first embodiment of the present disclosure, aconnector between an anode and a cathode and via holes 165 a and 165 bare aligned in a horizontal direction within a block. Also, blocks onand under the open area 136 are connected on the same layer by a thirdconnection line 166.

That is, in each block, the plurality of LEDs 140 is disposed in seriesby the first connection electrode 117 a and the second connectionelectrode 117 b. Also, a first via hole 165 a and a second via hole 165b are provided at one end of the first connection electrode 117 a andone end of the second connection electrode 117 b, respectively, and thuscan be connected to a first connection line 161 and a second connectionline 162.

Actually, the first connection electrode 117 a and the second connectionelectrode 117 b may refer to the same component. For the convenience ofdescription, the first connection electrode 117 a may refer to anelectrode located on the anode side of the LED 140 and the secondconnection electrode 117 b may refer to an electrode located on thecathode side of the LED 140.

FIG. 8 illustrates an example where twelve LEDs 140 are disposed inseries by the first connection electrode 117 a and the second connectionelectrode 117 b. However, the present disclosure is not limited to thenumber of LEDs 140 disposed in each block.

Also, the one end of the first connection electrode 117 a is exposed bythe first via hole 165 a. The first connection electrodes 117 a ofblocks vertically adjacent to each other may be connected to each otherby the first connection lines 161 disposed in a vertical directionthrough the first via holes 165 a of the blocks vertically adjacent toeach other.

In this case, the first connection line 161 may be provided in eachcolumn, and blocks in the same column except the block under the openarea 136 may be connected to each other by the same first connectionline 161.

One end of each first connection line 161 may be connected to the firstconnection electrode 117 a of the block on the open area 136 through thefirst via hole 165 a. Also, the first connection electrodes 117 a of theblocks on and under the open area 136 may be connected to each other bya third connection line 166. In this case, the first connectionelectrode 117 a and the third connection line 166 may be disposed on thesame layer, and the first connection electrode 117 a and the firstconnection line 161 may be disposed on different layers. However, thepresent disclosure is not limited thereto.

Also, the block under the open area 136 further includes a firstsub-connection line 161′. One end of the first sub-connection line 161′may be connected to the first connection electrode 117 a through thefirst via hole 165 a and the other end may be extended to the open area136. The first connection electrode 117 a and the first sub-connectionline 161′ may be disposed on different layers. However, the presentdisclosure is not limited thereto.

A plurality of second connection lines 162 may be provided in eachcolumn. The second connection lines 162 corresponding in number to thenumber of blocks disposed in each column except the block under the openarea 136 may be provided. For example, in the same column, one ends ofthe second connection electrodes 117 b of blocks in respective rows maybe connected to the second connection lines 162 through the second viaholes 165 b of the blocks in the respective rows. That is, in the samecolumn, one end of the second connection electrode 117 b of a block in afirst row may be connected to the second connection line 162 disposedfirst on the leftmost side of the same column through the second viahole 165 b of the block in the first row. Also, one end of the secondconnection electrode 117 b of a block in a second row may be connectedto the second connection line 162 disposed second in the same columnthrough the second via hole 165 b of the block in the second row.Further, one end of the second connection electrode 117 b of a block inan n-1th row may be connected to the second connection line 162 disposedlast on the rightmost side of the same column through the second viahole 165 b of the block in the n-1th row. Herein, n refers to the totalnumber of blocks in each row, and the block in the n-1th row may referto the block on the open area 136.

Also, a block in an nth row, e.g., the block under the open area 136,further includes a second sub-connection line 162′. One end of thesecond sub-connection line 162′ may be connected to the secondconnection electrode 117 b through the second via hole 165 b and theother end may be extended to the open area 136. The second connectionelectrode 117 b and the second sub-connection line 162′ may be disposedon different layers. However, the present disclosure is not limitedthereto.

Meanwhile, in the first embodiment of the present disclosure, the firstand second via holes 165 a and 165 b are disposed within the blocks.Also, the connector between the anode and the cathode (e.g., portionsconnecting the first connection electrode 117 a and the secondconnection electrode 117 b to the first connection line 161 and thesecond connection line 162, respectively) and the first and second viaholes 165 a and 165 b are aligned in the horizontal direction. That is,since the first and second via holes 165 a and 165 b are disposed withinthe blocks, it is possible to suppress an increase in size of a bezelarea caused by the first and second via holes 165 a and 165 b. Also,since the connector between the anode and the cathode and the first andsecond via holes 165 a and 165 b are aligned in the horizontaldirection, it is possible to more densely dispose a plurality of secondconnection lines 162 in the open area 136. Therefore, it is possible toreduce the width of the open area 136. That is, the connector betweenthe anode and the cathode and the first and second via holes 165 a and165 b are disposed at an upper end of the block in the n-1th row andaligned in the horizontal direction. Thus, a plurality of secondconnection lines 162 can be bent toward the center while avoiding thesecond via hole 165 b. Therefore, it is possible to more densely disposethe plurality of second connection lines 162 in the open area 136.Accordingly, it is possible to reduce a routing area and a bezel area.Also, it is possible to reduce costs of the sub-FPCB 130 and reduceprocess errors.

FIG. 9 illustrates an example of a block structure according to acomparative embodiment.

FIG. 10 shows an example of a layout of lines in an LED assemblyaccording to the comparative embodiment.

Referring to FIG. 9 and FIG. 10 , it can be seen in the comparativeembodiment that first and second via holes 65 a and 65 b are disposedoutside a block. Also, it can be seen that a connector between an anodeand a cathode, e.g., portions connecting a first connection electrode 17a and a second connection electrode 17 b to a first connection line anda second connection line, respectively, and the first and second viaholes 65 a and 65 b are misaligned in the horizontal direction.

When the first and second via holes 65 a and 65 b are disposed outsidethe block as in the comparative embodiment, the size of a bezel areaincreases by the protruded width of the first and second via holes 65 aand 65 b outside the block.

Also, when the connector between the anode and the cathode and the firstand second via holes 65 a and 65 b are misaligned in the horizontaldirection, the second connection lines illustrated in FIG. 6 and FIG. 7of the present disclosure described above cannot be disposed. That is,in the comparative embodiment, a plurality of second connection lines 62cannot be bent toward the center while avoiding the second via hole 65b. Therefore, a miniaturization design of a routing area cannot beachieved. Also, when a via hole avoidance design is implemented, theorder of pads may be changed or the number of layers may be increased.

Accordingly, in the comparative embodiment, a width W2 of an open area36 cannot be reduced, which results in an increase in size of a bezelarea.

FIG. 11 is a cross-sectional view schematically illustrating an LEDdisplay device according to a second embodiment of the presentdisclosure.

The second embodiment of the present disclosure shown in FIG. 11 issubstantially the same as the above-described first embodiment exceptthat a liquid crystal panel 270 is provided at an upper part of abacklight unit. Therefore, a redundant description thereof will beomitted.

Referring to FIG. 11 , the LED display device according to the secondembodiment of the present disclosure may largely include the liquidcrystal panel 270 and the backlight unit disposed under the liquidcrystal panel and supply backlight to the liquid crystal panel.

Here, the backlight unit may include a plurality of optical sheets 250and the main FPCB 110 where the plurality of LEDs 140 is mounted. Also,the backlight unit may include the sub-FPCB 130 connected to the mainFPCB 110 and the cover bottom 120 in which the plurality of LEDs 140 andthe main FPCB 110 are accommodated.

The liquid crystal panel 270 may include pixels disposed in a matrixform to output an image. Also, the liquid crystal panel 270 may includea color filter substrate 272 and an array substrate 271 that face eachother and are bonded to each other to maintain a uniform cell gap.Further, the liquid crystal panel 270 may include a liquid crystal layerformed in the cell gap between the color filter substrate 272 and thearray substrate 271.

Although not specifically illustrated, a common electrode and a pixelelectrode may be formed on the liquid crystal panel 270, with the colorfilter substrate 272 and the array substrate 271 being bonded to eachother, to apply an electric field to the liquid crystal layer. When avoltage of a data signal applied to the pixel electrode is controlled ina state where a voltage is applied to the common electrode, liquidcrystals of the liquid crystal layer may be rotated due to dielectricanisotropy according to an electric field between the common electrodeand the pixel electrode. Thus, the liquid crystals may transmit or blocklight for each pixel to display text or images.

In this case, to control the voltage of the data signal applied to thepixel electrode for each pixel, switching devices such as thin filmtransistors (TFTs) may be respectively provided in pixels. That is, agate line and a data line vertically and horizontally arranged to definea pixel area may be disposed on the array substrate 271, and a TFT as aswitching device may be formed at an area of overlap between the gateline and the data line.

The TFT may include a gate electrode connected to the gate line, asource electrode connected to the data line, and a drain electrodeconnected to the pixel electrode.

The color filter substrate 272 may include a color filter including aplurality of sub-color filters for implementing red, green, and bluecolors and a black matrix that may separate the sub-color filters andblock light transmitted through the liquid crystal layer. Also, thecolor filter substrate 272 may include an overcoat layer provided on thecolor filter and the black matrix.

Polarizing plates may be attached to the outside of the color filtersubstrate 272 and the array substrate 271, respectively. The lowerpolarizing plate may polarize light transmitted through the backlightunit in a direction toward the array substrate 271, and the upperpolarizing plate may polarize light transmitted through the liquidcrystal panel 270.

Also, a guide panel may be provided at the edges of the backlight unitunder the liquid crystal panel 270. The guide panel may support theupper liquid crystal panel 270 and may accommodate therein the coverbottom 120 together with the backlight unit disposed therein.

The plurality of optical sheets 250 for enhancing the efficiency oflight emitted from a light source and emitting light to the liquidcrystal panel 270 may be provided on an LED assembly.

Meanwhile, the main FPCB 110 may be attached to an inner upper surfaceof the cover bottom 120 by the adhesive layer 125. A connector, forexample, anisotropic conductive film 135 connected to the sub-FPCB 130may be provided on a rear surface of the main FPCB 110. Also, thesub-FPCB 130 may be connected to the ACF 135 on the rear surface of themain FPCB 110 and then connected to the outside through the open area136 formed in the cover bottom 120.

One end of the sub-FPCB 130 may be bent to the rear surface of the mainFPCB 110 and located within the open area 136, and may be connected tothe main FPCB 110 through the ACF 135.

According to the second embodiment of the present disclosure, theplurality of LEDs 140 is not disposed in the open area 136 as in theabove-described first embodiment.

Meanwhile, according to the first embodiment of the present disclosure,the blocks on and under the open area are connected on the same layerthrough the third connection line, but the present disclosure is notlimited thereto. The blocks on and under the open area may be connectedby the first connection line. This will be described in detail withreference to FIG. 11 .

FIG. 12 shows an example of a layout of lines in an LED assemblyaccording to a third embodiment of the present disclosure.

The third embodiment of the present disclosure shown in FIG. 12 issubstantially the same as the above-described first embodiment exceptthat blocks on and under the open area 136 are connected by a firstconnection line 361. Therefore, a redundant description thereof will beomitted.

Referring to FIG. 12 , in the third embodiment of the presentdisclosure, the connector between the anode and the cathode and thefirst and second via holes 165 a and 165 b are aligned in the horizontaldirection within a block. Also, the blocks on and under the open area136 are connected by the first connection line 361.

That is, in each block, a plurality of LEDs (not shown) is disposed inseries by the first connection electrode 117 a and the second connectionelectrode 117 b. Also, the first via hole 165 a and the second via hole165 b are provided at one end of the first connection electrode 117 aand one end of the second connection electrode 117 b, respectively, andthus can be connected to the first connection line 361 and a secondconnection line 362.

Here, as described above, for the convenience of description, the firstconnection electrode 117 a may refer to an electrode located on theanode side of the LED and the second connection electrode 117 b mayrefer to an electrode located on the cathode side of the LED.

The one end of the first connection electrode 117 a is exposed by thefirst via hole 165 a. The first connection electrodes 117 a of blocksvertically adjacent to each other may be connected to each other by thefirst connection lines 361 disposed in a vertical direction through thefirst via holes 165 a of the blocks vertically adjacent to each other.

In this case, the first connection line 361 may be provided in eachcolumn, and blocks in the same column may be connected to each other bythe same first connection line 361. Therefore, the third connection linedescribed in the first embodiment is not required, and, thus, it ispossible to further reduce a bezel area.

That is, one ends of the first connection lines 361 may be respectivelyconnected to the first connection electrodes 117 a of the blocks in thesame column through the first via holes 165 a. In this case, the firstconnection electrode 117 a and the first connection line 361 may bedisposed on different layers. However, the present disclosure is notlimited thereto.

Also, the block under the open area 136 further includes a firstsub-connection line 361′. One end of the first sub-connection line 361′may be connected to the first connection line 361 through the first viahole 165 a and the other end may be extended to the open area 136. Thefirst connection electrode 117 a and the first sub-connection line 361′may be disposed on different layers. However, the present disclosure isnot limited thereto.

Further, a plurality of second connection lines 362 may be provided ineach column. The second connection lines 362 corresponding in number tothe number of blocks disposed in each column except the block under theopen area 136 may be provided. For example, in the same column, one endsof the second connection electrodes 117 b of blocks in respective rowsmay be connected to the second connection lines 362 through the secondvia holes 165 b of the blocks in the respective rows. That is, in thesame column, one end of the second connection electrode 117 b of a blockin a first row may be connected to the second connection line 362disposed first on the leftmost side of the same column through thesecond via hole 165 b of the block in the first row. Also, one end ofthe second connection electrode 117 b of a block in a second row may beconnected to the second connection line 362 disposed second in the samecolumn through the second via hole 165 b of the block in the second row.Further, one end of the second connection electrode 117 b of a block inan n-1th row may be connected to the second connection line 362 disposedlast on the rightmost side of the same column through the second viahole 165 b of the block in the n-1th row. Herein, n refers to the totalnumber of blocks in each row, and the block in the n-1th row may referto the block on the open area 136.

Also, a block in an nth row, e.g., the block under the open area 136,further includes a second sub-connection line 362′. One end of thesecond sub-connection line 362′ may be connected to the secondconnection electrode 117 b through the second via hole 165 b and theother end may be extended to the open area 136. The second connectionelectrode 117 b and the second sub-connection line 362′ may be disposedon different layers. However, the present disclosure is not limitedthereto.

Meanwhile, in the third embodiment of the present disclosure, the firstand second via holes 165 a and 165 b are disposed within the blocks.Also, the connector between the anode and the cathode and the first andsecond via holes 165 a and 165 b are aligned in the horizontaldirection. Therefore, it is possible to suppress an increase in size ofa bezel area caused by the first and second via holes 165 a and 165 b.Also, it is possible to more densely dispose a plurality of secondconnection lines 362 in the open area 136 and thus possible to reducethe width of the open area 136. Accordingly, it is possible to reduce arouting area and a bezel area. Also, it is possible to reduce costs ofthe sub-FPCB and reduce process errors.

FIG. 13 is a cross-sectional view schematically illustrating an LEDdisplay device according to a fourth embodiment of the presentdisclosure.

The fourth embodiment of the present disclosure shown in FIG. 13 issubstantially the same as the above-described second embodiment exceptthat a sensor unit or sensor 480 is disposed between a plurality of LEDs440. Therefore, a redundant description thereof will be omitted.

Referring to FIG. 13 , the LED display device according to the fourthembodiment of the present disclosure may largely include the liquidcrystal panel 270 and the backlight unit disposed under the liquidcrystal panel and supply backlight to the liquid crystal panel.

Here, the backlight unit may include the plurality of optical sheets 250and the main FPCB 110 where the plurality of LEDs 440 is mounted. Also,the backlight unit may include the sub-FPCB 130 connected to the mainFPCB 110 and the cover bottom 120 in which the plurality of LEDs 440 andthe main FPCB 110 are accommodated.

In this case, an LED assembly may include the plurality of LEDs 440 andthe main FPCB 110 where the plurality of LEDs 440 is mounted.

The optical sheet 250 is disposed on the LED assembly, and the coverbottom 120 is disposed under the LED assembly. Thus, the LED assemblyand the optical sheet 250 may be accommodated within the cover bottom120.

The optical sheet 250 may include at least one of a diffusion sheet, aprism sheet, a brightness enhancement film, such as DBEF, and aprotective sheet.

The sensor unit 480 may be provided on the main FPCB 110. Each sensorunit 480 may be disposed between adjacent ones of the plurality of LEDs440.

The sensor unit 480 may include at least one of a proximity sensor, anillumination sensor, a fingerprint sensor, a near infrared (N-IR) chip,and an ultraviolet (UV) chip.

As for a portable terminal, a proximity sensor and an illuminationsensor are disposed over a front surface of the portable terminal.Therefore, it is beneficial to provide a non-display area mainly for theproximity sensor and the illumination sensor. However, when the sensorunit 480 is disposed between the LEDs 440, it is possible to reduce anon-display area. Thus, it is possible to implement a slim bezelstructure or a bezel-less structure. In a conventional fingerprintsensor, fingerprint recognition is possible only at a predetermined orselected position by using a physical button. However, when afingerprint sensor is disposed between the LEDs 440, a fingerprint canbe easily recognized at any portion of a display area.

An N-IR chip provides a skin care function, such as skin whitening,removal of dead skin cells, suppression of sebum secretion, and areduction in size of skin pores, using near infrared light. The N-IRchip stimulates the epidermis and dermis using red-based LED lighthaving a wavelength of from about 600 to about 700 nm and IR LED lighthaving a wavelength of from about 800 to about 980 nm. Thus, the N-IRchip provides an effect enabling the skin to induce self-healing whenstimulated.

Also, a UV chip provides sterilization effects using UV light. Forexample, a user may easily sterilize an area to be sterilized by using aportable terminal provided with the UV chip. Furthermore, in this case,the portable terminal can be used in a relatively clean condition.

The embodiments of the present disclosure can also be described asfollows:

-   -   According to an aspect of the present disclosure, there is        provided a display device. The display device includes a main        FPCB including a plurality of LEDs in a block unit or block on        one surface and a connector connected to the LEDs on the other        surface; a sub-FPCB connected to the connector of the main FPCB;        and a cover bottom in which the main FPCB is disposed and the        sub-FPCB is connected to the outside through an open area,        wherein in each block, the plurality of LEDs is disposed in        series by a plurality of first connection electrodes and second        connection electrodes, wherein the first and second via holes        are disposed within the blocks, and one end of the first        connection electrode and one end of the second connection        electrode are exposed by a first via hole and a second via hole.

The LED may be not disposed at a position facing the open area.

The first connection electrode may be located on an anode side of theLED, and the second connection electrode may be located on a cathodeside of the LED.

The display device may further include a first connection line disposedon the main FPCB in a row direction, wherein the first connectionelectrodes of the plurality of LEDs may be connected to each other bythe first connection lines through the first via holes of the pluralityof LEDs in the row direction.

The first connection line may be provided in each column, and blocks inthe same column except a block under the open area may be connected toeach other by the same first connection line.

One end of each first connection line may be connected to the firstconnection electrode of a block on the open area through the first viahole, and the first connection electrodes of the blocks on and under theopen area may be connected to each other by a third connection line.

The first connection line may be provided in each column, and blocks inthe same column may be connected to each other by the same firstconnection line.

One ends of the first connection lines may be respectively connected tothe first connection electrodes of the blocks in the same column throughthe first via holes.

The block under the open area may further include a first sub-connectionline, and one end of the first sub-connection line may be connected tothe first connection electrode through the first via hole and the otherend may be extended to the open area.

A plurality of second connection lines may be provided in each column,and the second connection lines corresponding in number to the number ofblocks disposed in each column except the block under the open area maybe provided.

In the same column, one ends of the second connection electrodes ofblocks in respective rows may be connected to the second connectionlines through the second via holes of the blocks in the respective rows.

In the same column, one end of the second connection electrode of ablock in a first row may be connected to the second connection linedisposed first on the leftmost side of the same column through thesecond via hole of the block in the first row, one end of the secondconnection electrode of a block in a second row may be connected to thesecond connection line disposed second in the same column through thesecond via hole of the block in the second row, one end of the secondconnection electrode of a block in an n-1th row may be connected to thesecond connection line disposed last on the rightmost side of the samecolumn through the second via hole of the block in the n-1th row, nrefers to the total number of blocks in each row, and the block in then-1th row refers to the block on the open area.

A block in an nth row may further include a second sub-connection line,and one end of the second sub-connection line may be connected to thesecond connection electrode through the second via hole and the otherend may be extended to the open area.

In the block in the n-1th row, the plurality of second connection linesmay be bent toward a center of the open area while avoiding the secondvia hole thus may be more densely disposed in the open area.

The first via hole and the second via hole are disposed in the same linein a column direction. Portions connecting the first connectionelectrode and the second connection electrode to the first connectionline and the second connection line, respectively, and the first andsecond via holes may be located in the same line in the columndirection.

The LED is disposed at a position facing the open area.

The display device may further include a sensor unit disposed betweenthe plurality of LEDs. Although the embodiments of the presentdisclosure have been described in detail with reference to theaccompanying drawings, the present disclosure is not limited thereto andmay be embodied in many different forms without departing from thetechnical concept of the present disclosure. Therefore, the embodimentsof the present disclosure are provided for illustrative purposes onlybut not intended to limit the technical concept of the presentdisclosure. The scope of the technical concept of the present disclosureis not limited thereto. Therefore, it should be understood that theabove-described embodiments are illustrative in all aspects and do notlimit the present disclosure. The protective scope of the presentdisclosure should be construed based on the following claims, and allthe technical concepts in the equivalent scope thereof should beconstrued as falling within the scope of the present disclosure.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

1. A display device, comprising: a main flexible printed circuit board(FPCB) including a plurality of light emitting diodes (LEDs) in aplurality of blocks on one surface, and a connector connected to theplurality of LEDs on another surface; a sub-FPCB connected to theconnector of the main FPCB; and a cover bottom in which the main FPCB isdisposed and the sub-FPCB is connected to the outside through an openarea, wherein in each of the plurality of blocks, LEDs of the pluralityof LEDs therein are disposed in series by a plurality of firstconnection electrodes and second connection electrodes, wherein firstvia holes and second via holes are disposed within the plurality ofblocks, and one end of the first connection electrode is exposed by arespective one of the first via holes and one end of the secondconnection electrode is exposed by a respective one of the second viaholes.
 2. The display device according to claim 1, wherein the pluralityof LEDs are not disposed at a position facing the open area.
 3. Thedisplay device according to claim 1, wherein the first connectionelectrode is located on an anode side of the LEDs, and the secondconnection electrode is located on a cathode side of the LEDs.
 4. Thedisplay device according to claim 3, further comprising: a plurality offirst connection lines disposed on the main FPCB in a row direction,wherein the first connection electrodes of the plurality of LEDs areconnected to each other by the plurality of first connection linesthrough the first via holes of the plurality of LEDs in the rowdirection.
 5. The display device according to claim 4, wherein theplurality of first connection lines is provided in each column, andblocks in the same column except a block under the open area areconnected to each other by the same first connection line.
 6. Thedisplay device according to claim 5, wherein one end of each of theplurality of first connection lines is connected to the first connectionelectrode of a respective block on the open area through the first viahole, and the first connection electrodes of the blocks on and under theopen area are connected to each other by a third connection line.
 7. Thedisplay device according to claim 4, wherein a respective one of thefirst connection lines is provided in each column, and blocks in thesame column are connected to each other by the same first connectionline.
 8. The display device according to claim 7, wherein first ends ofthe first connection lines are respectively connected to the firstconnection electrodes of the blocks in the same column through the firstvia holes.
 9. The display device according to claim 6, wherein the blockunder the open area further includes a first sub-connection line, andone end of the first sub-connection line is connected to the firstconnection electrode through the first via hole and the other end isextended to the open area.
 10. The display device according to claim 9,wherein a plurality of second connection lines is provided in eachcolumn, and the second connection lines are providing having numbercorresponding to the number of blocks disposed in each column except theblock under the open area.
 11. The display device according to claim 10,wherein in the same column, first ends of the second connectionelectrodes of blocks in respective rows are connected to the secondconnection lines through the second via holes of the blocks in therespective rows.
 12. The display device according to claim 11, whereinin the same column, one end of the second connection electrode of ablock in a first row is connected to the second connection line disposedfirst on the leftmost side of the same column through the second viahole of the block in the first row, one end of the second connectionelectrode of a block in a second row is connected to the secondconnection line disposed second in the same column through the secondvia hole of the block in the second row, one end of the secondconnection electrode of a block in an n-1th row is connected to thesecond connection line disposed last on the rightmost side of the samecolumn through the second via hole of the block in the n-1th row, nrefers to the total number of blocks in each row, and the block in then-1th row refers to the block on the open area.
 13. The display deviceaccording to claim 12, wherein a block in an nth row further includes asecond sub-connection line, and one end of the second sub-connectionline is connected to the second connection electrode through the secondvia hole and the other end is extended to the open area.
 14. The displaydevice according to claim 12, wherein in the block in the n-1th row, theplurality of second connection lines is bent toward a center of the openarea while avoiding the second via hole and thus is more denselydisposed in the open area.
 15. The display device according to claim 1,wherein the first via hole and the second via hole are disposed in thesame line in a column direction.
 16. The display device according toclaim 15, wherein portions connecting the first connection electrode andthe second connection electrode to the first connection line and thesecond connection line, respectively, and the first and second via holesare located in the same line in the column direction.
 17. The displaydevice according to claim 1, wherein the plurality of LEDs is disposedat a position facing the open area.
 18. The display device according toclaim 17, further comprising: a sensor unit disposed between theplurality of LEDs.
 19. The display device according to claim 7, whereinthe block under the open area further includes a first sub-connectionline, and one end of the first sub-connection line is connected to thefirst connection electrode through the first via hole and the other endis extended to the open area.
 20. The display device according to claim8, wherein the block under the open area further includes a firstsub-connection line, and one end of the first sub-connection line isconnected to the first connection electrode through the first via holeand the other end is extended to the open area.